Improved adhesive method for microscopic examination of fungi in culture.
AUTOR(ES)
Rodriguez-Tudela, J L
RESUMO
A new method for the examination of molds that involves the use of a device that dispenses a thin layer of a transparent adhesive material over the surface of a coverslip is described. The advantages of this method over previous methods used for the microscopic examination of molds are delineated.
ACESSO AO ARTIGO
http://www.pubmedcentral.nih.gov/articlerender.fcgi?artid=270381Documentos Relacionados
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